Thermal Conductive Plastics


The material has lower toughness and stronger rigidity. It is better to optimize the parts structure to meet the application requirements. The vertical structure design should be avoided and the module heat sink can be reinforced or chamfered.

From the reliability verification of the simulated outdoor extreme environment, the long-term data retention rate of mechanical properties, dimensional stability and thermal conductivity of the material in the long-term aging test at high temperature, thermal shock, double 85, and ultraviolet is more than 90%.
(excluding test error and characteristics of the resin matrix itself)