Thermal Interface material
Lyter provide gap filler/ thermal interface products, including thermal silicone pad, thermal conductive gel, thermal graphite sheet, phase change materials that meet the demands of any application.
Our thermal products fill in air gaps and microscopic irregularities, resulting in significantly lower thermal resistance and thus better cooling of increasingly hotter 5G and other components. More effective heat transfer helps a new product achieve faster regulatory compliance.
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Features
- High thermal conductivity - Low thermal resistance
- Thermal silicone pad : Soft, excellent compression - Excellent insulation & Work at high temperature
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Applications
- Power Supply & LED
- Automotive Electronics & New energy battery Security - Communication Equipment & Network Terminal - Storage Device - Consumer Electronics & Mobile phone |
Note
- Provide the customized die cutting - Storage condition: Storage temperature: ≤ 30 ℃ Storage humidity: ≤ 70% - Shelf life: 2 Years - Compliance UL&RoHS
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Thermal Silicone Pad:
| PROPERTIES | LT-H100 | LT-H150 | LT-H200 | LT-H250 | LT-H300 | LT-H350 | LT-H400 | LT-H500 | LT-H600 | LT-H700 | LT-H800 |
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Color (Visual) |
GrayWhite | Pink | LightBlue | LightYellow | SkyBlue | Green | Purple | White | Gray | Gray | Gray |
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Thickness (mm,ASTMD374) |
0.2~18 | 0.3~18 | 0.3~18 | 0.3~18 | 0.3~18 | 0.5~4.0 | 0.5~4.0 | 0.5~3.0 | 0.5~3.0 | 0.5~3.0 | 0.5~3.0 |
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Hardness (ShoreC,ASTMD2240) |
8~60(±5) | 10~55(±5) | 10~55(±5) | 10~55(±5) | 15~55(±5) | 18~60(±5) | 35~55(±5) | 25~55(±5) | 35~50(±5) | 35(±5) | 35(±5) |
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Density (g/cc,ASTMD792) |
2.35(±0.5) | 2.62(±0.5) | 2.8(±0.5) | 2.93(±0.5) | 3.01(±0.5) | 3.05(±0.5) | 3.12(±0.5) | 3.2(±0.5) | 3.2(±0.5) | 3.25(±0.5) | 3.4(±0.5) |
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TensileStrength (MPa,ASTMD412) |
≧0.3 | ≧0.25 | ≧0.25 | ≧0.20 | ≧0.15 | ≧0.15 | ≧0.15 | ≧0.15 | ≧0.15 | ≧0.1 | ≧0.12 |
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Elongation (%,ASTMD412) |
≧80 | ≧80 | ≧70 | ≧70 | ≧60 | ≧60 | ≧60 | ≧60 | ≧50 | ≧45 | ≧60 |
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CompressionRatio (%,ASTMD695) |
≧25(@50psi) | ≧25(@50psi) | ≧25(@50psi) | ≧20(@50psi) | ≧20(@50psi) | ≧15(@50psi) | ≧15(@50psi) | ≧15(@50psi) | ≧15(@50psi) | ≧15(@50psi) | ≧20(@50psi) |
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ULCertification (UL94) |
V-0,5V | V-0,5V | V-0,5V | V-0,5V | V-0,5V | V-0,5V | V-0,5V | V-0,5V | V-0 | V-0 | V-0 |
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OperatingTemperature (℃,IEC60068-2-14) |
-50~180 | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | -50~150 | -50~150 | -50~130 |
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ThermalConductivity (W/mK,ASTMD5470) |
1.0(±0.2) | 1.5(±0.2) | 2.0(±0.2) | 2.5(±0.2) | 3.0(±0.25) | 3.5(±0.25) | 4.0(±0.25) | 5.0(±0.25) | 6.0(±0.5) | 7.0(±0.5) | 8.0(±0.5) |
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ThermalResistance (℃in²/W,ASTMD5470) |
≦2.0 (@20psi/1mm) | ≦1.5 (@20psi/1mm) | ≦1.2 (@20psi/1mm) | ≦1.0 (@20psi/1mm) | ≦0.90 (@20psi/1mm) | ≦0.80 (@20psi/1mm) | ≦0.75 (@20psi/1mm) | ≦0.70 (@20psi/1mm) | ≦0.5 (@20psi/1mm) | ≦0.30 (@20psi/1mm) | ≦0.20 (@20psi/1mm) |
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BreakdownVotage (KV/mm,ASTMD149) |
≧8 | ≧8 | ≧8 | ≧8 | ≧8 | ≧8 | ≧8 | ≧7 | ≧7 | ≧8 | ≧8 |
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VolumeResistivity (Ω·cm,ASTMD257) |
≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 | ≧1010 |
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DielectricConstant (@MHz,ASTMD150) |
≧2 | ≧2 | ≧2 | ≧2 | ≧2 | ≧2 | ≧2 | ≧5 | ≧5 | ≧5 | ≧5 |
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DielectricLoss (@MHz,ASTMD150) |
≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 | ≦0.1 |
Application ：
Thermal conductive interface material (TIM)
Heat conduction interface materials are used between heat source and radiator. By removing the air between heat source and radiator, the heat of electronic equipment can be more evenly distributed and the heat transfer efficiency can be accelerated. Generally, all kinds of thermal conductive interface materials need to have good thermal conductivity and surface wettability (the surface wettability of thermal conductive graphite is poor).
Can thermal conductive interface materials be backed?
Thermal conductive silica gel gasket and thermal conductive graphite sheet series can provide back adhesive. According to customer demand, each thermal conductive silica gel gasket and thermal conductive graphite sheet can be made into single and double back adhesive, and the shape and size can also be die cut into any shape according to requirements. The thermal conductive silicone gasket series is self-adhesive and easy to assemble. It is better not to prepare double-sided adhesive, because the double-sided adhesive will reduce the heat transfer efficiency of the material.
Will thermal conductive interface materials cause short circuit between electronic components?
can't. The thermal conductive interface materials provided by netj are all insulating materials, and the withstand voltage value is over several thousand volts, which will not cause short circuit of electronic components.
Can the size of thermal interface material be customized?
sure. The thermal conductive interface materials provided by netj can be customized according to the die cutting requirements of customers.
What's the difference between silicon free thermal conductive gasket and silicone thermal conductive gasket?
Silicon free thermal conductive gasket means that there is no silicone oil leakage when the gasket is used, which can ensure that there is no silicone oil or silicon molecule pollution when it is used in specific occasions. Silicone thermal conductive gasket adheres to the excellent mechanical properties and weather resistance of silicone, and has good applicability in the use of temperature and mechanical properties; However, the silicone free gasket is made by a specific organic process, and its service temperature is slightly lower than that of silicone products.
How to choose thermal conductive interface materials?
Firstly, the type of thermal conductive interface material is determined according to the customer's application scenarios (such as application industry, flatness of the interface, special requirements, etc.); According to the thermal conductivity, thickness, size, density, withstand voltage, temperature and other parameters of the product, the appropriate thermal interface material is selected. The choice of thickness is related to the gap size of the Tim position of the product that the customer needs to solve the problem of heat dissipation, and the density, hardness, compression ratio and other parameters of the Tim product itself. It is recommended that the specific parameters be determined after the sample test. The choice of thermal conductivity mainly depends on the power consumption of the heat source of the product that needs to solve the problem of heat dissipation, as well as the heat dissipation capacity of the radiator or heat dissipation structure. The best size is to cover the heat source, not the contact surface of the radiator or heat dissipation structure. When the size is larger than the heat source, the heat dissipation will not be greatly improved. How to choose the best matching GASKET? It can test the actual heat transfer resistance of a variety of thermal conductive gaskets (at least 3 kinds, different thermal conductivity, hardness, thickness, etc.).
What are the applications of thermal conductive interface materials?
Communication equipment, network terminal, data transmission, led, automobile, new energy, electronics, consumer electronics, intelligent terminal, medical equipment, military, aerospace, all the places that need heat transfer, heat dissipation and filling.
LYTER TECHNOLOGIES LIMITED
